Custom DC positioners with theta-X planarizing capability and true Kelvin probes have allowed for successful demonstration of consistent and repeatable test results in fully automatic micro-bump wafer ...
MANHASSET, N.Y. — Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump ...
GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE ...
SAN JOSE, Calif. — Citing renewed demand, Singapore's STATS ChipPAC Ltd. is expanding its capacity for wafer-level packaging. STATS ChipPAC has been on a production ramp with wafer-level packaging ...
Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming ...
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