Cadence's new Chiplet Spec-to-Packaged Parts partner ecosystem reduces engineering complexity and accelerates time to market ...

Cadence Design Systems (CDNS) recently announced a Chiplet Spec-to-Packaged Parts ecosystem, aimed at simplifying chiplet ...

Chiplets enable scalability but dramatically raise interconnect complexity and risk. Silicon-proven NoC technology is the key ...

Engineers develop GaN semiconductors, liquid cooling systems and chiplet packaging to handle growing AI power demands in data ...

The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...

At CES 2026, Cadence announced an ecosystem which delivers pre-validated (spec-to-packaged parts) for physical AI, data ...

According to post-CES details showing up online, it appears that AMD will not use the same chiplet design for its next-gen APUs, keeping the chiplet design for its 2nd generation EPYC and 3rd ...

A fresh batch of rumors suggest that AMD is currently in the early design phase of the RDNA 3 architecture, and it could represent the most radical change of GPU design ever. AMD could shift towards ...

Nvidia has "de-risked" creating GPUs from AMD Zen 2-style multiple chiplets, but its engineers say it's still not at a point where the technology makes sense in terms of dropping it into a next-gen ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...

One of the struggles of high core counts is communication between cores and outside the CPU. This problem is one that AMD has been grappling with since the launch of Zen. With up to 32 cores and now ...