Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated that the computing ...

Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC. The use of well-established IC ...

Design innovations play a key role in the evolution of clean manufacturing, especially in the area of packaging. All of clean manufacturing’s top goals, from waste minimization to energy efficiency to ...

The world of packaging design has undergone a remarkable transformation in recent decades, driven by digital advancements and ...