Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...

Advancing AI Chip Manufacturing With Applied Materials Today Building the chips that power artificial intelligence is getting ...

Samsung, SK hynix, and Micron are fighting each other over new 16-Hi HBM memory, as NVIDIA requests the new 16-Hi HBM memory ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

Researchers in Japan have developed ultrathin ferroelectric capacitors that maintain strong polarization at a stack thickness ...

An ultrathin ferroelectric capacitor, designed by researchers from Japan, demonstrates strong electric polarization despite ...

Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking one of the largest capital rounds in the ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...

NAND flash technology is on a roll with advancements in cell structure and the subsequent boost in storage density. That allows this non-volatile-memory (NVM) chip to deliver faster throughput and ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...