Chip designs are busting out beyond the reticle limits of lithography machines, making chiplets and high-bandwidth, in-package die-to-die interconnects inevitable. And AI training workloads are ...

Belden Inc. has redesigned its Layer 3 modular Gigabit switch to create a new version, the MSP30-X Modular Switch, which is suited for extreme environments. The switch not only maintains its modular ...

Mechanical keyboards have seen a massive increase in popularity in recent years, especially among PC enthusiasts who demand perfection from every aspect of their build. Now, Chinese manufacturer ...

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