Renesas debuts a power-efficient vision AI MPU with an integrated DRP-AI accelerator that eliminates the need for cooling ...

TI’s MSPM0C1104 MCU in a WCSP is 38% smaller than the industry’s current smallest MCU, targeting space-constrained devices.

Precision timing will play a vital role in technology evolution as the heartbeat of intelligent, connected electronics.

At embedded world 2025, Synaptics launches the SR-Series adaptive MCUs for scalable context-ware edge AI computing.

Synaptics introduces the SYN461x Triple Combo SoCs for embedded edge AI IoT applications at embedded world 2025.

Analog Devices, Inc. (ADI) has expanded its suite of embedded solutions with enhanced capabilities for its CodeFusion Studio ...

Ambiq will showcase its Apollo330 Plus SoCs for always-on and real-time edge AI applications at Embedded World 2025.

Qualcomm unveils its X85 5G modem-RF, Dragonwing cellular infrastructure platform for 5G O-RAN, and Dragonwing 5G Advanced ...

Murata’s digital envelope tracking technology enhances the power efficiency of RF circuits for 5G and 6G devices.

Semtech expands its family of 5G broadband modules to address different performance and cost optimization needs.

Metanoia unveils its ultra-low-power MT5824 5G SoC in a compact footprint, designed to accelerate Open RAN adoption.

MediaTek unveils its M90 5G Advanced modem with AI for enhanced power efficiency, supporting sub-6-GHz and mmWave.